Life Science Imaging
We Welcome Your Custom Business
Teledyne DALSA is uniquely positioned to offer innovative custom solutions to exceed your next generation requirements. With design and manufacturing expertise and engineering services spanning sensors, cameras, vision modules, specialized illumination, optics, data acquisition, and image processing, Teledyne DALSA Custom Solutions delivers vision solutions tuned to your most challenging applications.
Time to market is critical, and Teledyne DALSA has the tools in place to fast track challenging product developments. Customers will benefit from dedicated project teams focused on leading edge design, build, and manufacturing processes as well as a highly trained technical support team to assist with product test and integration.
Custom Examples
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| Six-tile x-ray panel, 30 cm x 24 cm | Intra-oral CMOS imaging | Custom x-ray camera |
To manufacture our advanced custom designs, Teledyne DALSA has developed its own unique technologies and process capabilities, which allows us to build high-performance imager sensors on the scale of an entire wafer. For even larger devices, we have the technology to butt wafer-scale tiles together with boundaries as small as one or two pixels, and to align these tiles for optimum flatness to extremely tight tolerances. Our deep portfolio of patents and intimate knowledge of these processes coupled with our outstanding design capabilities allow Teledyne DALSA to tailor solutions optimized for custom applications.
Teledyne DALSA is both experienced in and committed to meeting both schedule and technical challenges in all its OEM custom development programs.
Custom design requirements range from repackaging or optimizing existing designs for a specific application to the development of novel sensor configurations not available anywhere else. Teledyne DALSA’s internal R&D efforts continually add to the technology pool from which we can draw to provide solutions to your imaging requirements.
If your application requires a fully customized sensor designed to your specifications, our R&D groups are well equipped to meet the challenge. A typical custom development consists of 3 to 5 months of design time during which you the customer are actively involved. This is followed by 3 to 4 months of prototype fabrication time and 2 to 3 months of detailed device characterization.
X-Ray Capabilities
Teledyne DALSA offers considerable expertise in indirect X-Ray detectors. We have many years of experience in multiple applications, working with different scintillators and coupling fiber-optics to CCD and CMOS imagers. We offer a range of pixel sizes and our optimized designs provide low noise and tremendous dynamic range for high contrast even at low X-Ray dose. Our large, buttable CMOS tiles can be assembled into panels of 30 x 24 cm and more.
- Low-noise, high bandwidth crystalline CMOS image sensors with radiation-hard pixel design delivering benchmark imaging quality and leading image resolution from still image to full video frame rates.
- High-speed distributed and non-destructive dose sensing, giving a low-resolution "preview" to monitor image accumulation during the actual X-ray exposure, reducing the need for image retakes.
- Precision conversion layer attachment technology to ensure optimal MTF and high image resolution.
- Compatible with multiple conversion layer solutions tuned to your application requirements.
- High-precision assembly technology capable of positioning and fixation of multiple sensors with a gap smaller than 50 microns.
- Radiation-hard pixel design to ensure stable operation, optimal imaging quality and long operational lifetime of the sensor.
Do you have a custom challenge for us? Contact Teledyne DALSA Sales.
More Information
Do you have a custom challenge for us? Contact Teledyne DALSA Sales.
Teledyne DALSA custom product expertise:
- Custom image sensor design and development, both CCD and CMOS
- Backside thinned TDI and area devices for increased QE in DUV range
- Variety of scintillator options
- Fiber optic bonding
- High density packaging including SMT for more than 300 pins
- Wafer scale devices for radiography, astronomy and remote sensing
- Radiation hardened designs
- Color Filter Arrays
- Custom image sensor package development
