Semiconductor & MEMS Foundry

Single Step Processing Services

In addition to complete wafer fabrication processes, Teledyne DALSA offers to its customers specific single manufacturing step services as described below.

Bonding

Teledyne DALSA offers a wide variety of bonding technologies available for customers looking for a reliable foundry partner to rapidly expand their own internal capacity for such a critical MEMS processing step. Our bonding technology portfolio includes the following techniques:

Si-Si, Si-SiO₂ and SiO₂-SiO₂ bonding
Eutectic bonding
Solder bonding
Thermo-compression bonding
Glass frit sealing
Anodic bonding
Plasma-assisted polymer bonding
Temporary bonding

Plating

Teledyne DALSA provides electroless and electrolytic wafer bumping technology for various applications. Teledyne DALSA offers the following technologies for wafer plating:

Electroless Ni / Pd bumping
Electrolytic solder bumping (SnPb, SnAgCu, In )
Wafer level printing (eutectic SnPb, Sn, Ag, Cu, In)

Grinding

Wafer thinning has become an important step for CMOS/CCD technologies but further more for MEMS technologies. Teledyne DALSA owns state-of-the-art tools for wafer thinning (grinder) and polishing (CMP tool).

Implantation

Ion implantation is the standard method for the doping of silicon in CMOS/CCD technologies. We offer the following capabilities:

in the 1E11-1E14 at/cm² range, implantation of boron, phosphorus and arsenic in the 5-500 keV range
in the 1E14-1E17 at/cm² range, implantation of boron, phosphorus and arsenic in the 5-200 keV range

Other capabilities can be developed upon request.